Circuit review & bench-test guide
Selectable USB-C PD trigger
Document purpose#
This document explains the usb-c-pd-trigger prototype at component level and turns the design evidence into a practical manual-review and bench-test plan. It is based on the implemented schematic, PCB, manufacturing BOM, selector harness specification, calculations, and QA evidence in this directory.
The board is still a prototype. Repository QA records 41 PASS, 5 CONDITIONAL, 18 OPEN, and 0 FAIL results. In particular, there is no recorded first-article bench result. Calculated and simulated values below are targets to verify, not proof that an assembled board is safe or conforming.
1. What the board does#
The board is a power-only USB Type-C Power Delivery sink. A five-position, two-pole external selector chooses a 5 V, 9 V, 12 V, 15 V, or 20 V ceiling. The HUSB238A negotiates autonomously, requests up to 3 A, and turns on a contract-authoritative P-channel MOSFET. A TPS259470A eFuse then applies a controlled ramp and adds current limiting, overload timing, overvoltage lockout, reverse-current blocking, and fault reporting.
It does not support USB data, PPS, AVS, EPR, or 5 A operation. The green LED means protected output voltage is present; it does not prove which PD voltage was negotiated or that 3 A is available.
Functional block diagram#
CC1 / CC2
USB-C J1 ─────────────────────┐
v
VBUS_RAW ───────────────> HUSB238A U1 <── two-pole selector J2
│ │ GATE VSET + EN_N interlock
├── D1 TVS2200 v
├── D2 negative clamp Q1 40 V P-MOSFET
└── C1 input bypass │
v
PD_VBUS
│
v
TPS259470A U2
eFuse / RCB / OVP
│
v
VOUT ──> J4 main output
├────> J5 light-load header
├────> J6 status/sense
└────> green output LED
2. Safety and scope boundaries#
- Use a certified, isolated USB-PD source or a current-limited PD source emulator. Do not connect this board directly to mains-derived circuitry.
- Use J4 and suitable 18–20 AWG wiring for high-current tests. Keep J5 at or below 0.5 A; solderless breadboards are not 3 A interconnects.
- Connect an earth-referenced oscilloscope ground only to board GND. Use a differential probe for high-side or floating measurements.
- Do not externally drive VOUT while USB is attached until reverse-energy behavior has been deliberately reviewed. Never tie two uncontrolled sources.
- Change selector position at no load first. The break-before-make EN_N pole is safety-critical; a damaged or incorrectly wired selector can request the wrong voltage.
- Do not perform IEC ESD/surge testing on an ordinary bench. The documented TVS/eFuse worst-case clamp margin is unresolved.
- A working negotiation is not USB-IF, EMC, safety, or environmental certification. Do not apply a USB logo based on prototype operation.
3. Power and control sequence#
- With no cable, R6 holds Q1's gate at its source, so Q1 is off. U2 has no input and VOUT is off.
- The selector connects
SNK_VSETto one programmed resistance and groundsHUSB_EN_Nonly at a valid detent. Between detents EN_N opens. - The source detects the HUSB238A sink on CC1 or CC2 and initially supplies default USB-C VBUS.
- U1 reads R3 as the 3 A request and the selected VSET resistance as the voltage ceiling, then negotiates the best acceptable fixed PDO.
- After a valid contract, U1's GATE output pulls
PMOS_GATElow through R5. Q1 connectsVBUS_RAWtoPD_VBUS; D3 limits excessive negative VGS. - U2 checks enable/UVLO and the R14/R15 OVLO divider. If valid, it ramps VOUT according to C3, limits current according to R17, and times overloads with C4.
- C6 charges, D6 lights through R20, and the load can use J4. The sense divider R18/R19 reports a scaled VOUT on J6/TP4.
Why there are two series switches#
Q1 is controlled by the PD controller and is therefore the switch that says a contract has been accepted. U2 is a separate protection boundary. Removing Q1 would let the eFuse pass the source's default VBUS without contract authority; removing U2 would discard the precise inrush, overload, OVLO, fault, and always-on reverse-blocking functions. Their combined voltage drop and heating must be measured at 3 A.
4. Selector and external interfaces#
The intended external switch is a Grayhill 56A36-01-2-05N DP5T non-shorting selector wired to J2. Both commons must be open between detents.
| Position | J2 VSET path | J2 EN_N path | Program resistor | Requested ceiling |
|---|---|---|---|---|
| 5 V | pin 1 to pin 3 | pin 2 to pin 4/GND | R7 = 0 Ω | 5 V |
| 9 V | pin 1 to pin 5 | pin 2 to pin 6/GND | R8 = 3.00 kΩ | 9 V |
| 12 V | pin 1 to pin 7 | pin 2 to pin 8/GND | R9 = 6.04 kΩ | 12 V |
| 15 V | pin 1 to pin 9 | pin 2 to pin 10/GND | R10 = 11.0 kΩ | 15 V |
| 20 V | pin 1 to pin 11 | pin 2 to pin 12/GND | R11 = 19.1 kΩ | 20 V |
An open VSET input means “highest voltage” for this controller, so the second pole is essential: it disables U1 between positions instead of allowing an open contact to become an accidental high-voltage request.
| Reference | Pins/signals | Intended use |
|---|---|---|
| J1 | USB-C VBUS, GND, CC1, CC2 | PD source connection; data/SBU unused |
| J2 | 12-pin VSET/EN_N harness | Production selector connection |
| J3 | same selector map | DNP development header only |
| J4 | 1 VOUT, 2 GND | Main 3 A Molex Micro-Fit output |
| J5 | VOUT, VOUT, GND, GND | DNP light-load header, ≤0.5 A |
| J6 | VOUT_SENSE, PD_FAULT, EFUSE_FLT_N, GND | DNP status header |
| Test point | Net | Expected role |
|---|---|---|
| TP1 | VBUS_RAW | Negotiated source voltage before Q1 |
| TP2 | PD_VBUS | Voltage after Q1 and before U2 |
| TP3 | VOUT | Protected output |
| TP4 | VOUT_SENSE | 0–about 3.2 V scaled output |
| TP5 / TP6 | CC1 / CC2 | High-impedance PD probing only |
| TP7 | GND | Probe reference |
| TP8 | SNK_VSET | Selected programming voltage/resistance node |
| TP9 | HUSB_EN_N | Low only at a valid selector detent |
| TP10 | PMOS_GATE | Q1 gate-drive observation |
5. Component-by-component review#
5.1 Contract and main power path#
| Ref. | Part / datasheet summary | Function and why needed | If absent/open | If shorted, wrong, or misassembled |
|---|---|---|---|---|
| J1 | GCT USB4105-GF-A-120, USB-C receptacle | Reversible source connection; parallels VBUS/GND contacts and keeps CC1/CC2 separate | No power; an open CC pad may make only one orientation fail; partial VBUS/GND soldering can overheat at load | VBUS–GND trips the source; CC–VBUS can destroy U1; CC1–CC2 breaks orientation behavior |
| U1 | Hynetek HUSB238A-BB001, autonomous PD sink controller | Detects source, negotiates the fixed PDO, interprets VSET/ISET, and authorizes Q1 | Standards-compliant PD negotiation and contract-controlled turn-on are lost | Wrong variant/strap can request the wrong power; damaged GATE may leave Q1 permanently off or on |
| Q1 | Diodes Inc. DMP4015SSS-13, −40 V P-channel MOSFET | Contract-authoritative high-side switch between raw and protected buses | PD_VBUS stays off | D-S short bypasses contract isolation; excessive RDS(on) causes drop/heating; reversed assembly changes body-diode behavior |
| U2 | TI TPS259470ARPWR, 2.7–23 V, 5.5 A-class, 28 mΩ typical eFuse | Adds soft start, adjustable current limit/timer, OVLO, overload/short protection, thermal shutdown, fault output, and true reverse blocking | No protected output | IN–OUT short bypasses protection; wrong suffix changes response; poor QFN soldering raises resistance or defeats thermal removal |
| J4 | Molex 43650-0210; mating 43645-0200 | Locking, polarized primary output appropriate for the intended current when correctly crimped | No useful main output | Reversed harness can damage the load; weak crimp/contact causes heat and voltage loss |
5.2 Transient, reverse, and gate protection#
| Ref. | Value / part | Purpose | What is lost if omitted | Important failure/review point |
|---|---|---|---|---|
| D1 | TI TVS2200DRVR, 22 V standoff flat-clamp TVS | Shunts positive VBUS surge/ESD energy near J1 | Downstream parts see larger positive transients | TI specifies up to 28.4 V clamp at 40 A while U2 IN absolute max is 28 V: no guaranteed 0.4 V margin at that cited corner |
| D2 | Diodes Inc. B340A-13-F, 3 A/40 V Schottky | Clamps negative VBUS excursions to GND | Negative events can pull U1/Q1 input below ground | A short becomes VBUS-to-GND; polarity and SMA solder fillets matter |
| D3 | Nexperia BZT52H-C10, 10 V zener | Limits Q1 source-to-gate voltage at 15/20 V contracts | Q1 may exceed its VGS rating | Short holds gate at source and Q1 off; wrong polarity provides no intended clamp |
| D5 | Nexperia PMEG4010EH, 40 V Schottky | Clamps negative VOUT events before U2 is overstressed | Negative externally induced output transients are less controlled | Short kills VOUT; it is not a substitute for safe reverse-injection testing |
| R5 | 10 kΩ | Limits/isolates U1 GATE drive into Q1 gate and zener network | Gate transients and controller stress increase | Open keeps Q1 off; too large slows switching excessively |
| R6 | 100 kΩ | Pulls Q1 gate to source so default state is off | Gate can float and Q1 may partially turn on | Short is effectively gate-to-source, permanently off |
5.3 U1 programming, indications, and bypass#
| Refs. | Value | Function | If omitted or wrong |
|---|---|---|---|
| R1, R2 | 900 kΩ each | Required DEBUG_N and EN_HVDCP biasing to GND | Undefined or wrong controller mode |
| R3 | 21.0 kΩ, 1% | Programs 3 A SNK_ISET | Open/wrong value changes the requested-current policy; it does not make a cable/source capable of 3 A |
| R7–R11 | 0 Ω, 3.00 kΩ, 6.04 kΩ, 11.0 kΩ, 19.1 kΩ | Five VSET codes | Open can mean highest voltage; wrong tolerance/value selects the wrong ceiling |
| C1 | 2.2 µF, 50 V X7R | Local raw-VBUS energy and high-frequency bypass | More supply bounce and susceptibility during negotiation/switching |
| C2 | 1 µF, 10 V X7R | HUSB238A VDD decoupling | Controller resets, unstable negotiation, or EMI sensitivity |
| R4 + D4 | 2.2 kΩ + red LED | Visual indication from PD_FAULT | No local visual status; wrong LED polarity makes it dark |
5.4 eFuse programming and output network#
| Refs. | Value / calculation | Function | If omitted or wrong |
|---|---|---|---|
| R12 | 470 kΩ, PD_VBUS to EN/UVLO | Enables U2 from the input; U2 internal UV protection remains active | Open holds output off; short removes intended input impedance and can over-stress the pin |
| R14 / R15 | 1.74 MΩ / 100 kΩ | Programs OVLO; calculated rising trip 21.36–22.93 V, 22.08 V nominal | Open/short can disable output or remove the intended 20 V overvoltage guard |
| R17 | 976 Ω, 1% | Programs current limit: 3.013–3.757 A, 3.421 A nominal | Open/wrong value changes both protection and current-monitor interpretation |
| C3 | 330 pF C0G | Programs about 6.06 V/ms VOUT slew; about 3.3 ms to 20 V | Open causes fastest/uncontrolled ramp; too large slows startup and can interact with source timing |
| C4 | 2.2 nF C0G | Programs overload blanking: 1.08–3.35 ms, 1.85 ms nominal | Open/minimum timer trips peaks quickly; too large permits longer fault energy |
| C5 | 1 µF, 50 V X7R | Local U2 input bypass after Q1 | More ringing and less local transient current |
| C6 | 10 µF, 50 V X7R | Minimum local output reservoir and loop/load decoupling | Larger droop/ringing; startup behavior changes; arbitrary extra capacitance raises inrush |
| R18 / R19 | 187 kΩ / 33 kΩ | Scales VOUT for measurement; worst calculated 3.204 V at 21 V | Open/short can report zero, full VOUT, or load the output; do not feed a lower-voltage ADC without its own tolerance review |
| R20 + D6 | 4.7 kΩ + green LED | Indicates VOUT presence | No visual output indication; it never proves the selected PDO or current entitlement |
5.5 Mechanical, shield, and option parts#
| Refs. | Part / value | Purpose and population rule |
|---|---|---|
| J2 | JST SM12B-SRSS-TB | Required selector harness interface; verify latch, pin numbering, and both poles |
| J3, J5, J6 | Development/status headers | DNP in core SMT build; populate only for the intended test configuration |
| R22 + C8 | 1 MΩ + 4.7 nF C0G | High-impedance/DC bleed plus AC coupling from USB shell to board ground; omitting leaves the shell floating, shorting creates a hard chassis bond |
| R23 | 0 Ω shield link | DNP alternative to R22/C8; never populate casually because it changes grounding/EMC behavior |
| R16, R21, D7 | 47 kΩ, 10 kΩ, red LED | Mandatory DNP eFuse-fault LED option. U2 FLT is recommended for at most 5 V and has 6.5 V absolute max; pulling it to VOUT could expose it to 20 V |
6. Datasheet summary and design interpretation#
| Device | Key manufacturer facts used here | Board-specific interpretation |
|---|---|---|
| HUSB238A | Autonomous USB PD sink; fixed-voltage request selection via external VSET resistance; current request via ISET; GATE controls an external PMOS | Verify every selector code against an actual analyzer. The design's external EN_N interlock is required because open VSET selects the highest option |
| TPS259470A | 2.7–23 V operating input, 28 V absolute maximum, 28.3 mΩ typical RON, adjustable 0.5–6 A limit, dV/dt, ITIMER, OVLO, fast short response, thermal shutdown, FLT, and always-on reverse blocking | The 20 V rail fits the operating range. The selected components calculate to ~3.42 A limit and ~3.3 ms 20 V rise. Validate hot RON, retry behavior, and FLT voltage |
| TVS2200 | 22 V standoff, 24.6 V minimum breakdown, maximum 28.4 V clamp at 40 A 8/20 µs, 40 A surge capability, 105 pF typical | Excellent normal 20 V compatibility, but the maximum clamp exceeds U2's 28 V absolute maximum by 0.4 V at the cited extreme. Treat surge immunity as open |
| DMP4015SSS | −40 V P-MOSFET, low resistance with adequate negative gate drive | At the 5 V contract the drive is only about −4.5 V; repository estimate uses ≤15 mΩ and ≤0.135 W at 3 A. Measure rather than extrapolate |
| B340A / PMEG4010EH / BZT52H-C10 | Schottky negative clamps and 10 V gate zener | They manage polarity/transient edges but do not make destructive fault injection automatically safe |
Official references: HUSB238A product page, TPS25947 datasheet/product page, TVS2200 datasheet/product page, and DMP4015SSS product page. Check the latest revision and exact orderable suffix before procurement.
7. Expected values before bench testing#
| Quantity | Design target / calculated range | What to measure |
|---|---|---|
| Requested PDO ceiling | 5, 9, 12, 15, or 20 V | Source analyzer contract and TP1 |
| Current request | 3 A | PD request messages; source/cable may offer less |
| OVLO rising trip | 21.36–22.93 V; 22.08 V nominal | Controlled supply sweep on protected-path subtest |
| Current limit | 3.013–3.757 A; 3.421 A nominal | Electronic-load ramp and waveform |
| Overload blanking | 1.08–3.35 ms; 1.85 ms nominal | Current/VOUT/FLT scope capture |
| VOUT slew | about 6.06 V/ms | TP2 and TP3 differential timing |
| 20 V rise time | about 3.3 ms | 10–90% and full-ramp captures |
| Fitted-cap inrush | about 61 mA for the modeled ramp | Source current capture; actual load capacitance changes this |
| Sense at 21 V worst corner | ≤3.204 V calculated | TP4 with calibrated DMM |
| U2 loss at 3 A | 0.254 W typical, 0.405 W maximum estimate | Thermal camera/thermocouple and input-output drop |
| Q1 loss at 3 A | ≤0.135 W estimate | Q1 drop and case/board temperature |
| Combined switch loss | ≤0.540 W estimate | 60-minute thermal soak, worst ambient/enclosure |
8. Manual schematic and assembly review checklist#
- Confirm J1 CC1 and CC2 are separate and that all intended VBUS/GND pads are soldered. Inspect four shell stakes for adequate solder fill and retention.
- Verify exact U1/U2/Q1 orientation and orderable suffixes. Inspect U2's 2 mm QFN and D1 WSON with X-ray where available.
- Confirm D1, D2, D3, D4, D5, and D6 polarity.
- Measure R3 and R7–R11 values before installing the harness.
- Buzz J2 pin numbering from the board through the cable to the selector. Test both poles and confirm open-before-close between every adjacent position.
- Confirm R16, R21, D7, R23, and development headers are DNP for the core build.
- Inspect high-current copper transitions at J1, Q1, U2, and J4. Look for solder voiding, mask damage, whiskers, and insufficient via/pad wetting.
- Check that the J4 harness is pinned VOUT-to-load-positive and GND-to-return.
9. Ordered bench-test procedure#
Stop at the first abnormal result. Save raw captures with board serial number, source/cable identity, equipment ID, calibration date, ambient, and operator.
A. Unpowered inspection and resistance tests#
- Disconnect USB, load, selector, and oscilloscope.
- Inspect the assembly under magnification; complete the checklist above.
- Measure VBUS_RAW-to-GND, PD_VBUS-to-GND, and VOUT-to-GND resistance in both meter polarities. Investigate a hard short before power.
- Confirm no DC short from shell to GND; R22 should read about 1 MΩ after C8 settles when R23 is DNP.
- Verify J2 selector continuity and break-before-make action with an ohmmeter.
B. First attach, no load#
- Set selector to 5 V. Use a current-limited PD source/analyzer and no load.
- Attach in one cable orientation. Capture CC, VBUS_RAW, PD_VBUS, VOUT, PMOS_GATE, and negotiated request as equipment permits.
- Expect TP1 near 5 V, TP2 only after contract/GATE action, and a controlled TP3 ramp. Confirm the green LED and sense ratio.
- Repeat after flipping the USB-C plug.
- Repeat at 9, 12, 15, and 20 V. Confirm the analyzer's actual contract; do not infer voltage from selector position or LED state.
C. Selector safety and source mismatch#
- With no load, rotate slowly through every detent while monitoring TP8, TP9, TP10, TP1, and TP3. EN_N must release and the path must disconnect between positions before a new request takes effect.
- Try sources that lack selected PDOs and sources/cables that cannot provide 3 A. Record whether U1 selects a lower acceptable PDO or refuses the path, and verify the result is safe for the intended downstream load.
- Do not proceed to loaded hot rotation until unloaded behavior is repeatable.
D. Load regulation and thermal soak#
- Use J4, short heavy leads, remote DMM sense at J4, and an electronic load.
- At each supported voltage, sweep 0 A, 0.1 A, 0.5 A, 1 A, 2 A, and 3 A while respecting the source/cable contract.
- Record TP1, TP2, TP3, J4 voltage, input current, output current, Q1/U2/J1/J4 temperature, and FLT/PD_FAULT state.
- Run 60 minutes at 3 A at worst intended ambient. Compare measured switch loss to the 0.540 W combined estimate and check connector/copper hot spots.
E. Dynamic, overload, and reverse tests#
- Apply controlled load steps and capture VOUT deviation/recovery, source current, and fault outputs with bandwidth limits stated.
- Increase load slowly through current limit, then test a controlled hard short using a safe fixture. Capture current limit, ITIMER, shutdown/retry, and temperature. Do not repeatedly short a hot board.
- Repeat with representative added output capacitance; verify inrush and PD source stability rather than assuming the 61 mA fitted-cap estimate applies.
- With USB absent, inject a current-limited voltage at VOUT below, equal to, and slightly above the intended rail as allowed by the test plan. Confirm U2 reverse blocking and that TP1/TP2 are not energized unexpectedly.
F. Release-only tests#
Perform source/cable interoperability, brownout/attach endurance, ESD, surge, EMC, product safety, and environmental compliance under controlled lab plans. The TVS2200/U2 clamp-margin question must be explicitly resolved before a surge claim or production release.
10. Troubleshooting map#
| Symptom | First measurements | Likely areas |
|---|---|---|
| No VBUS in either orientation | CC1/CC2, source log, J1 solder | J1, U1 power/CC, source/cable |
| One orientation fails | CC1 versus CC2 continuity | J1 CC pad/open trace/U1 pin |
| TP1 correct, TP2 zero | EN_N, VSET, GATE, PMOS_GATE | selector harness, U1, R5/R6/D3, Q1 |
| TP2 correct, TP3 zero | EN_UVLO, OVLO, FLT, dV/dt | U2, R12/R14/R15, C3, output short |
| Wrong negotiated voltage | analyzer request, TP8 resistance | R7–R11, J2 pinout, selector contact |
| VOUT oscillates/retries | current waveform, FLT, temperature | overload, C4, source collapse, U2 thermal |
| Excessive drop at 3 A | TP1→TP2 and TP2→TP3 separately | Q1 versus U2, J1/J4/cable, solder joints |
| Sense voltage wrong | TP3 and TP4, R18/R19 | divider value/solder, unexpected ADC load |
| Red eFuse LED populated | inspect R16/R21/D7 | unsafe assembly variant; remove and review |
11. Bench record template#
| Field | Record |
|---|---|
| Board revision / serial | |
| Assembly variant and DNP audit | |
| PD source, cable, analyzer IDs | |
| DMM/scope/load/thermal equipment and calibration | |
| Ambient, airflow, enclosure state | |
| Selector continuity/interlock result | |
| Contract result, both orientations, all positions | |
| No-load and 0–3 A regulation results | |
| Inrush/load-step/overload captures | |
| Reverse-blocking result | |
| 60-minute thermal result | |
| Deviations, photos, raw-file paths | |
| Reviewer / date / disposition |
12. Review conclusion#
The architecture is coherent: the HUSB238A owns the PD contract and Q1, while the TPS259470A provides a second, independent protection layer. The selector's two-pole interlock is not optional convenience—it prevents open VSET from becoming a high-voltage request. The principal release risks are unverified first-article behavior, 3 A thermal performance, hot selection and source interoperability, reverse/fault behavior, connector assembly quality, and the TVS2200 maximum-clamp versus U2 absolute-maximum mismatch.